nmHA® Recognized with ICIC Technology Innovation Award
ICIC 2026 International Cosmetics Innovation Conference successfully concluded at the Shanghai Marriott Hotel Parkview. Now in its seventh consecutive edition, the conference has established itself as a leading industry platform bringing together experts and innovators from across research, development, and the cosmetics industry. This year’s event focused on integrating industry and research, strengthening collaboration and connectivity, driving innovation across disciplines, and promoting authoritative scientific communication.
More than 3,000 professionals from the cosmetics, medical, and scientific research sectors attended, alongside over 200 industry experts, dermatology specialists, and brand leaders. Featuring 24 high-level forums and in-depth discussions across the industry value chain, the conference provided a platform for deeper collaboration among industry, academia, research, and medicine, supporting the continued advancement of China’s beauty industry.
Letop Biotechnology made a strong presence at the event, with Booth I-32 attracting a steady stream of visitors throughout the conference. Supported by strong R&D capabilities and extensive expertise in functional skincare ingredients, Letop Biotechnology gained widespread recognition from industry professionals, brand representatives, and business partners, highlighting its expertise and growing presence in the functional skincare ingredients sector.
A key highlight was the recognition of Letop Biotechnology’s flagship small-molecule Sodium Hyaluronate, nmHA®, with a molecular weight of <1,000 Da. Featuring excellent skin penetration, intensive hydration, and skin-barrier support, combined with advanced R&D and innovative technology, nmHA® received the ICIC Technology Innovation Notable Ingredient Award. This industry recognition reflects Letop Biotechnology’s commitment to scientific innovation and further reinforces its R&D capabilities and competitive strength in functional skincare ingredients.